INPLANE Photonics - Lossless Bus Interface Chip Module

Lossless Bus Interface Chip (LBIC) Module





The LBIC was developed in partnership with Lockheed Martin under Phase II of the AFRL HIP program. The target application is to provide add/drop functionality at the node in Avionics LANs. The LBIC is representative of a new class of highly integrated components, which address the mission critical needs for small light and robust solutions which are not met by COTS.

At the heart of the unit is the most highly integrated PLC chip manufactured to date. It has approximately 200 functional elements on a monolithic chip and is a true embodiment
of an “Optical IC”.

The LBIC supports 8-channel, bi-directional WDM traffic. On chip power splitting/coupling is used to sample the data stream. The sampled data is de-Muxed and actively filtered for drop channel selection, while an integrated EDWA is used to compensate for losses on the through port. Optical power is monitored in each direction for APC.
For further information on the LBIC, please contact us at info@inplane.com